Choose the appropriate size, emissivity, color, voltage, and current of the chip.

1. Expanding crystal: Evenly unfold the entire LED film provided by the manufacturer, and pull apart the tightly arranged LED particles attached to the surface of the film to prick the crystal.

2. Back glue. Place the expanded crystal ring on the back of the adhesive machine that has already scraped the silver paste layer, and apply the silver paste on the back. Point the silver paste. Suitable for bulk LED chips. Apply an appropriate amount of silver paste onto the printed circuit board through a dispensing machine.

3. Crystal fixation. Place the crystal expansion ring prepared with silver paste into the crystal frame, and the operator uses a crystal piercing pen to puncture the LED chip on the PCB under a microscope.

4. Step 4: Place the PCB printed circuit board with good crystal structure into a thermal cycling oven and let it stand for a period of time at a constant temperature. After the silver slurry solidifies, take it out (do not leave it for a long time, otherwise the LED chip coating will turn yellow, which will cause oxidation in Shanghai packaging and electronic component packaging, causing difficulties for bonding). Note: If there is LED chip bonding, the above steps are required. If there is only IC chip bonding, the above steps will be cancelled.

5. Welding wire, using an aluminum wire welding machine to bridge the chip with the corresponding solder pad aluminum wire on the PCB board, that is, to weld the inner lead of the COB.

6. During the initial testing, use specialized testing tools (with different equipment for different purposes of COB, such as high-precision regulated power supply) to test the COB board, and repair the unqualified board again.

7. Glue dispensing. Using a dispensing machine, apply an appropriate amount of AB glue to the LED grains prepared by bonding. The IC is packaged with black glue, and the power device is packaged. Then, the appearance packaging is carried out according to customer requirements.

8. Curing: Place the sealed PCB printed circuit board into a thermal cycling oven and let it stand at a constant temperature. Different drying times can be set according to requirements.

9. Post test. Use specialized testing tools to test the electrical performance of the packaged PCB printed circuit board and distinguish between good and bad.

10. Splitting, using a splitter to distinguish lights of different ambient brightness according to requirements, and then packaging them separately.

11. Warehousing. Afterwards, we will go out in batches and make contributions to the people!

The common types are pin type and patch type. The pin type can be perforated and welded with a circuit board, and the reverse side can be connected with a PCB to form a circuit, or it can be drilled, installed and fixed with an insulating board, and the reverse side can be connected with wires to form a circuit; Another type of SMD type lamp bead is mounted and welded on the surface of a PCB circuit board, which forms a circuit based on the PCB circuit. High power LEDs also need to use aluminum based circuit boards with high thermal conductivity for heat conduction, and heat sinks for heat dissipation in order to function properly.