In view of the limitations of LED devices and lamps in converting electrical energy into light energy, the concept of heat dissipation technology is proposed. Heat dissipation is designed to solve the problem of heat conduction and heat dissipation technology in the process of LED lighting. Thermal conductive materials such as thermal conductive adhesives, thermal conductive pads, thermal conductive chips, etc., remove the part of light energy converted from electrical energy, which is converted from electrical energy. The effect of the generated heat on the LED internal chip (making the chip performance degrade, aging or even failure).

1. The main factors affecting LED heat dissipation

The main factors affecting heat dissipation are material properties (thermal conductivity), thermally conductive potting glue, thermally conductive silicone grease, thermally conductive adhesive, packaging structure, packaging material, chip size, chip material, on-chip current density, etc. In general, LED lighting devices and lamps are composed of chips, circuit substrates, external heat sinks and drivers. Therefore, there are currently two heat dissipation design solutions: one is to reduce the conversion of LED devices from electrical energy into heat energy. The implementation process needs to improve the internal quantum efficiency of the LED internal devices, thereby improving the light output efficiency of the LED, and then solving the LED lighting (use) from the inside. The heat dissipation problem generated in the process; the second side is based on external design considerations, by changing the packaging materials or packaging methods of LED devices and lamps to achieve the purpose of reducing the thermal resistance of the packaging, and sometimes it is necessary to configure a suitable heat sink to solve the problem of high heat dissipation. The junction temperature problem, and then achieve the extension of the service life of the LED device.

2. Existing heat dissipation methods

Due to the limitations in technology, the method of changing the external design of the LED lighting device or using a heat sink is currently used to solve the heat dissipation problem. There are many heat dissipation methods for LED lighting devices at present, which can be divided into package-level potting and heat-dissipating adhesive methods and lamp-level heat-dissipating and thermally conductive adhesive methods. The package-level heat dissipation method, as the name suggests, is to reduce the thermal resistance of the package by optimizing the internal packaging structure and materials of the LED. and material selection principle based on substrate material and silicone adhesive material.